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6-inch Koch-Chemie Micro Cut Pad, fine abrasive sponge designed to remove light scratches and holograms with great control.
  • 6-inch Koch-Chemie Micro Cut Pad, fine abrasive sponge designed to remove light scratches and holograms with great control.
  • 5-inch Koch-Chemie Micro Cut Pad, fine abrasive sponge designed to remove light scratches and holograms with great control.
  • 3-inch Koch-Chemie Micro Cut Pad, fine abrasive sponge designed to remove light scratches and holograms with great control.
  • 2-inch Koch-Chemie Micro Cut Pad, fine abrasive sponge designed to remove light scratches and holograms with great control.
Koch-Chemie Micro Cut Pad

Koch-Chemie Micro Cut Pad

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$16.99
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Koch-Chemie's Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's Micro Cut M3.02 and/or Micro Cut & Finish P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety.

COMPRESSION HARDNESS: 10

ABRASIVENESS: 5
Materials + Care

We prioritize quality in selecting the materials for our items, choosing premium fabrics and finishings that ensure durability, comfort, and timeless appeal.
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We strive to process and ship all orders in a timely manner, working diligently to ensure that your items are on their way to you as soon as possible.

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